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Slip band-grain boundary interactions in commercial-purity titanium

机译:商业纯度钛中的滑带-晶界相互作用

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摘要

The interaction between slip bands and grain boundaries in commercial-purity titanium was examined using cross-correlation-based electron backscatter diffraction. At a low strain level, three types of interactions were observed: blocked slip band with stress concentration; slip transfer; and blocked slip band with no stress concentration. The stress concentration induced by the blocked slip band was fitted with Eshelby's theoretical model, from which a Hall-Petch coefficient was deduced. It was found that the Hall-Petch coefficient varies with the individual grain boundary. We investigated the geometric alignment between the slip band and various slip systems to the neighbouring grain. Stress concentration can be induced by the blocked slip band if the slip system is poorly aligned with prismatic, pyramidal or basal slip systems in the neighbouring grain. Transfer of slip across the boundary occurs when there is good alignment on prismatic or pyramidal slip systems. Other stress-relieving mechanisms are possible when the best alignment is not with the slip system that has the lower critical resolved shear stress. ©2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
机译:使用基于互相关的电子背散射衍射研究了商业纯度钛中滑带和晶界之间的相互作用。在低应变水平下,观察到三种类型的相互作用:带有应力集中的滑移带受阻;单据转移;滑带被阻塞,没有应力集中。由阻塞滑带引起的应力集中符合Eshelby的理论模型,由此推导了Hall-Petch系数。发现霍尔-Petch系数随各个晶界而变化。我们研究了滑移带和各种滑移系统与相邻晶粒之间的几何对准。如果滑移系统与相邻晶粒中的棱柱形,金字塔形或基底滑移系统对齐不当,则可能由于滑移带阻塞而导致应力集中。当棱柱形或金字塔形滑移系统良好对齐时,就会发生滑移跨边界的转移。当最佳对准不是与具有较低临界解析剪切应力的滑移系统最佳对准时,其他应力消除机制也是可能的。 ©2014 Acta Materialia Inc.,Elsevier Ltd.出版。保留所有权利。

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